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Data Sheet
ABSOLUTE MAXIMUM RATINGS
ADV7800
Table 5.
Parameter
AVDD to AGND
DVDD to DGND
PVDD to AGND
DVDDIO to DGND
DVDDIO_SDRAM to
DGND_SDRAM (DDR)
DVDDIO_SDRAM to
DGND_SDRAM (SDR)
DVDDIO to AVDD
DVDDIO to DVDD
DVDDIO_SDRAM to DVDD (DDR)
DVDDIO_SDRAM to DVDD (SDR)
AVDD to PVDD
AVDD to DVDD
DVDDIO to DVDDIO_SDRAM (DDR)
DVDDIO to DVDDIO_SDRAM (SDR)
AVDD to DVDDIO_SDRAM (DDR)
AVDD to DVDDIO_SDRAM (SDR)
Digital Inputs Voltage to DGND
Rating
4.0 V
2.2 V
2.2 V
4.0 V
2.7 V
4.0 V
?0.3 V to +0.3 V
?0.3 V to +2 V
?0.3 V to +2.5 V
?0.3 V to +3.3 V
?0.3 V to +2 V
?0.3 V to +2 V
?0.3 V to +2 V
?0.3 V to +3.3 V
?0.3 V to +2.5 V
?0.3 V to +1.8 V
DGND ? 0.3 V to DVDDIO + 0.3 V
PACKAGE THERMAL PERFORMANCE
To reduce power consumption when using the part, the user is
advised to turn off any unused ADCs.
The junction temperature must always stay below the
maximum junction temperature (T J MAX ) of 125°C. This
equation shows how to calculate the junction temperature:
T J = T A MAX + ( θ JA × W MAX )
where:
T A MAX = 85°C
θ JA = 21.0330°C/W
W MAX = ((AVDD × IAVDD) + (DVDD × IDVDD) + (DVDDIO ×
IDVDDIO) + (PVDD × IPVDD)+(DVDD_SDRAM ×
IDVDD_SDRAM )).
THERMAL RESISTANCE
θ JA is specified for the worst-case conditions, that is, a device
soldered in a circuit board for surface-mount packages.
Table 6. Thermal Resistance
DVDDIO_SDRAM Inputs to
DGND_SDRAM
Analog Inputs to AGND
DGND_SDRAM ? 0.3 V to
DVDDIO_SDRAM + 0.3 V
AGND ? 0.3 V to AVDD + 0.3 V
Package Type
176-Lead LQFP
θ JA1
21
θ JC2
7
Unit
°C/W
SCLK/SDA Data Pins to DVDDIO
Maximum Junction Temperature
DVDDIO ? 0.3 V to DVDDIO + 3.6 V
125°C
1
2
4-layer PCB with solid ground plane.
4-layer PCB with solid ground plane (still air).
(T J MAX )
Storage Temperature Range
Infrared Reflow Soldering (20 sec)
?65°C to +150°C
260°C
ESD CAUTION
Stresses above those listed under Absolute Maximum Ratings
may cause permanent damage to the device. This is a stress
rating only; functional operation of the device at these or any
other conditions above those indicated in the operational
section of this specification is not implied. Exposure to absolute
maximum rating conditions for extended periods may affect
device reliability.
Rev. C | Page 9 of 28
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